The present invention relates to the assembly of a passive thermal management system, namely a phase change material (PCM) heat sink, which includes a mechanism to relive the pressure within the chamber during the expansion of the phase change material.
The most common method of encapsulating PCM is to fill the chamber in its expanded state, i.e. liquid state, and seal. As the PCM cools and contracts, the capsule experiences a negative pressure. Another known method is to leave void air spaces ...